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Heat and Air flow distribution in a system rack（系统机架）

详细情况:
This case represents a real-life electronic system rack. The model is composed of the number of fully blocked and porous plates, solid elements, 5 apertures and fan; fan is a part of the equipment within the rack. Turbulence model used is LVEL model. System components generate heat and the simulation is used to find the maximum temperature.

详细图片如下：

1.System features

Rack Geometry：（机架模型）	Air flow pattern in the rack

2. Air velocity vectors （气流速度矢量图）
i. Velocity vectors at the rear wall.

.ii.Velocity vectors at the middle plane.

iii. Velocity vectors at the fan plane.

3.不同截面温度云图
i. Air temperatures at the rear wall.

ii. Air/solid temperatures at the middle plane.

iii. Air temperatures at the fan plane.

iv. Air/solid temperatures at cross planes.

v. Air/solid temperatures at vertical planes.